INSTABIZ SOLUTIONS
BOPP TAPE
Thermally Conductive Tape is designed to facilitate efficient heat transfer between heat-generating electronic components and cooling devices such as fans, heat sinks, or heat spreaders. This environmentally friendly tape is particularly useful for the thermal management of high-powered LEDs, enhancing the efficiency and reliability of electronic systems. With strong adhesion and excellent thermal conductivity, it is often used on heat sinks to dissipate heat effectively. When combined with thermal paste, its performance is further enhanced. Thermally conductive tape is also ideal for small or slender electronic components, providing effective heat dissipation for computer motherboards, video graphics cards, and backlight modules.
Features
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Flexible and Soft Surface: Adapts easily to various surfaces.
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Good Thermal Conductivity: Ensures efficient heat transfer.
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Strong Adhesion: Provides a secure bond between components and heat sinks.
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Voltage Resistance: Offers reliable insulation and protection.
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Environmentally Friendly: Safe for various applications and conditions.
Applications
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Electronic Equipment: Facilitates heat management in various electronic devices.
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LED Lighting: Enhances thermal management for high-powered LEDs.
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IC and Heat Sink Fixing: Ensures secure attachment and efficient heat dissipation.
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Chip and Heat Sink Adhesion: Provides strong adhesion and effective thermal transfer.
Sizes Available
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Cut Size: Customizable lengths, widths, and thicknesses.
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Log Rolls: Available in standard log or jumbo sizes.
Colors
White with Blue Liner
Adhesive Type
Acrylic Solvent (High Temp)
Thermally Conductive Tape is an essential solution for effective thermal management in electronic systems. Its strong adhesion, good thermal conductivity, and flexible nature make it ideal for a variety of applications, including electronic equipment, LED lighting, and heat sink fixation. Available in multiple sizes and featuring a high-temperature acrylic solvent adhesive, this tape ensures reliable performance and enhanced efficiency for heat dissipation tasks.